发明名称 |
Semiconductor packaging substrate and semiconductor device |
摘要 |
A semiconductor packaging substrate with a plurality of pads arranged in a square grid pattern thereon, in which among the pads, two pads obliquely adjacent to each other are connected with through-holes respectively and another through-hole is provided between the through-holes connected with the two pads obliquely adjacent to each other. |
申请公布号 |
US8319345(B2) |
申请公布日期 |
2012.11.27 |
申请号 |
US20100838447 |
申请日期 |
2010.07.17 |
申请人 |
ABE TATSUNOBU;MIYAMOTO SEIJI;HITACHI, LTD. |
发明人 |
ABE TATSUNOBU;MIYAMOTO SEIJI |
分类号 |
H01L23/48;H01L23/52 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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