发明名称 |
Molded semiconductor package having a filler material |
摘要 |
An integrated circuit is attached to a package substrate. The integrated circuit is electrically connected to the package substrate using a plurality of bond wires connected between a plurality of bond posts and a plurality of bond pads. A first plurality of the bond pads are along a first side of the integrated circuit and coupled to a first plurality of the bond posts with a first plurality of the bond wires. A second plurality of the bond pads are along a second side of the integrated circuit and coupled to a second plurality of the bond posts with a second plurality of the bond wires. Mold compound is injected through a plurality of openings in the package substrate. A first opening is between the first plurality of bond posts and the first side. A second opening is between the second plurality of bond posts and the second side.
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申请公布号 |
US8318549(B2) |
申请公布日期 |
2012.11.27 |
申请号 |
US20090608780 |
申请日期 |
2009.10.29 |
申请人 |
HESS KEVIN J.;LEE CHU-CHUNG;FREESCALE SEMICONDUCTOR, INC. |
发明人 |
HESS KEVIN J.;LEE CHU-CHUNG |
分类号 |
H01L21/00;H01L23/28;H01L23/29 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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