发明名称 |
Lead frame and method of manufacturing the same |
摘要 |
A lead frame having improved connectivity with a molded portion and a method of manufacturing the lead frame are provided. The lead frame includes a die pad on which a semiconductor chip is to be disposed; at least one lead portion arranged to be connected to the semiconductor chip; and at least one plating layer formed on at least one of the at least one lead portion and the die pad, wherein a top surface of the at least one plating layer has an uneven portion having a first average surface roughness.
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申请公布号 |
US8319340(B2) |
申请公布日期 |
2012.11.27 |
申请号 |
US20100883481 |
申请日期 |
2010.09.16 |
申请人 |
SHIM CHANG-HAN;PAEK SUNG-KWAN;SAMSUNG TECHWIN CO., LTD. |
发明人 |
SHIM CHANG-HAN;PAEK SUNG-KWAN |
分类号 |
H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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