发明名称 |
Adhesive tape and semiconductor device using the same |
摘要 |
The present invention relates to an adhesive tape for electrically connecting semiconductor chips in a chip-on-chip type semiconductor device. The adhesive tape comprising: (A) 10 to 50 wt % of film forming resin; (B) 30 to 80 wt % of curable resin; and (C) 1 to 20 wt % of curing agent having flux activity.
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申请公布号 |
US8319350(B2) |
申请公布日期 |
2012.11.27 |
申请号 |
US20070447657 |
申请日期 |
2007.10.30 |
申请人 |
SUMITOMO BAKELITE CO., LTD. |
发明人 |
KATSURAYAMA SATORU;YAMASHIRO TOMOE;HIRANO TAKASHI |
分类号 |
H01L25/065 |
主分类号 |
H01L25/065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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