| 摘要 |
PURPOSE: A light emitting diode package and a manufacturing method thereof are provided to improve a withstand voltage by intercepting currents flowing from a conductive layer to a plating layer by forming an insulating layer on the conductive layer. CONSTITUTION: An insulating layer(113) having thermal conductivity is formed on a conductive layer(111). A metal thin film layer(115) is formed on the insulating layer. A plating layer(117) is formed on the metal thin film layer. An LED chip(130) is formed on the plating layer. A dam part(150) is formed on the insulating layer around the LED chip. A resin(170) is formed on the LED chip.
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