发明名称 Device peeling apparatus using roll to roll methode
摘要 <p>PURPOSE: An apparatus for stripping a device from a substrate using a roll to roll method is provided to etch and strip a sacrificial layer in a single process while successively processes substrates using the roll to roll method. CONSTITUTION: A supply roll(110) supplies a stripped object(111) to an etching part(120). The stripped object comprises a substrate(113), a plurality of devices(119), and a sacrificial layer(115). The etching part etches the sacrificial layer by receiving the stripped object from the supply roll. A stripping part(130) stripes the device by receiving the substrate in which the sacrificial layer is etched. A collecting roll(140) collects the substrate in which the device is stripped. The supply roll and the collecting roll successively process the substrate using a roll to roll method. [Reference numerals] (AA) Etching gas</p>
申请公布号 KR20120128052(A) 申请公布日期 2012.11.26
申请号 KR20110045938 申请日期 2011.05.16
申请人 发明人
分类号 H01L21/786;H01L29/786;H01L33/00;H05K13/04 主分类号 H01L21/786
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