发明名称 |
PACKAGE STRUCTURE HAVING MEMS ELEMENTS AND FABRICATION METHOD THEREOF |
摘要 |
A package structure having MEMS elements includes: a wafer having MEMS elements, electrical contacts and second alignment keys; a plate disposed over the MEMS elements and packaged airtight; transparent bodies disposed over the second alignment keys via an adhesive; an encapsulant disposed on the wafer to encapsulate the plate, the electrical contacts and the transparent bodies; bonding wires embedded in the encapsulant and each having one end connecting a corresponding one of the electrical contacts and the other end exposed from a top surface of the encapsulant; and metal traces disposed on the encapsulant and electrically connected to the electrical contacts via the bonding wires. The present invention eliminates the need to form through holes in a silicon substrate as in the prior art so as to reduce fabrication costs. Further, the present invention accomplishes wiring processes by using a common alignment device to thereby reduce equipment costs.
|
申请公布号 |
US2012292722(A1) |
申请公布日期 |
2012.11.22 |
申请号 |
US201113242720 |
申请日期 |
2011.09.23 |
申请人 |
SILICONWARE PRECISION INDUSTRIES CO., LTD. |
发明人 |
LIN CHEN-HAN;CHANG HONG-DA;LIAO HSIN-YI;CHIU SHIH-KUANG |
分类号 |
H01L29/84;H01L21/56;H01L21/78;H01L31/0203;H01L31/0224;H01L31/18 |
主分类号 |
H01L29/84 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|