CIRCUIT BOARD PRODUCTION METHOD, AND CIRCUIT BOARD OBTAINED BY PRODUCTION METHOD

摘要

Provided is a production method for a circuit board, that includes a step for forming a circuit pattern in a resist formed on the surface of an insulating substrate, wherein the production method involves forming a resin coating of uniform thickness on the surface of an asperate structure, and reduces material loss, as a result obtaining an exceptional circuit board of extremely high reliability. The provided production method for a circuit board includes a resist formation step in which a resin coating is formed on the surface of an insulating substrate, and a circuit formation step in which, using the outer surface of the resin coating as a reference, recessed portions of a depth at least equal to the resin coating thickness are formed to form a circuit pattern; wherein the production method for a circuit board involves formation of the resin coating by electrostatic atomization.