| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device with suppressed occurrence of displacement and short-circuit failure at the time of mounting a semiconductor chip. <P>SOLUTION: A semiconductor device comprises: a semiconductor element CHP having end surfaces CEG and including an electric circuit; a plurality of lead frames LF electrically connected to the electric circuit of the semiconductor element CHP; and a resin material MR formed so as to cover the semiconductor element CHP. At end portions of the lead frames LF at the semiconductor element CHP side, semiconductor-element support portions IL1 and IL2 extending along the end surfaces CEG of the semiconductor element CHP and extending to the portion opposite to a rear surface CHPb continuous with the end surface CEG of the semiconductor element CHP are formed. <P>COPYRIGHT: (C)2013,JPO&INPIT |
