发明名称 |
CIRCUIT CONNECTION MATERIAL, CIRCUIT MEMBER CONNECTION STRUCTURE, AND CIRCUIT MEMBER CONNECTION STRUCTURE MANUFACTURING METHOD |
摘要 |
<p>The present invention is a circuit connection material for electrically connecting opposing circuit electrodes, comprising an adhesive composition and conductive particles. The conductive particles are aggregated particles with an average particle diameter of 5-20µm, having a metal or nickel core with a Vickers hardness of 300-1000 and an outermost layer of a precious metal coating the core. Unevennesses are formed on the surface of the conductive particles.</p> |
申请公布号 |
WO2012157375(A1) |
申请公布日期 |
2012.11.22 |
申请号 |
WO2012JP59804 |
申请日期 |
2012.04.10 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD.;NAKAZAWA TAKASHI;FUJINAWA TOHRU;TAKEMURA KENZOU;IIJIMA YUUSUKE |
发明人 |
NAKAZAWA TAKASHI;FUJINAWA TOHRU;TAKEMURA KENZOU;IIJIMA YUUSUKE |
分类号 |
H01R11/01;C09J7/00;C09J9/02;C09J11/04;C09J11/06;C09J163/00;C09J201/00;H01B1/00;H01B1/22;H01R4/04;H05K1/14;H05K3/32 |
主分类号 |
H01R11/01 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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