RESIN TRANSFER MOLDING METHOD AND RESIN TRANSFER MOLDING DEVICE

摘要

The purpose of the present invention is to provide a method for molding a molded article in which the surface and interior are free of voids, porosity, and resin shrinkage while sheet thickness accuracy is maintained even with a thick-sheet member having a thickness of 10 mm or more. A resin transfer molding method comprising: a first heating step for impregnating, with a thermoplastic resin, a reinforcing fiber substrate disposed within a molding die constituted of two or more separate die members, and thereafter heating any of the die members constituting the molding die to form a temperature gradient having a temperature difference of a predetermined value or greater from one side of the reinforcing fiber substrate to the other side; and a second heating step for heating another die member that is different from the die member heated in the first heating step.