| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent oxidation of a non-joined surface of a processed substrate during peeling processing between the processed substrate and a support substrate, which involves heating processing. <P>SOLUTION: A peeling device 30 includes: a first holding part 110 including a heating mechanism 128 and holding a processed wafer W; a second holding part 111 including a heating mechanism 151 and holding a support wafer S; a moving mechanism 170 relatively moving at least the first holding part 110 or the second holding part 111 in the horizontal direction; and a porous ring 130 which is annularly provided along an outer peripheral part of the first holding part 110, has multiple holes formed therein, and horizontally supplies an inactive gas to the outer peripheral part of the first holding part 110 holding the processed wafer W. The diameter of a holding surface 121a of a porous 121 holding the processed wafer W in the first holding part 110 is smaller than the diameter of the processed wafer W. <P>COPYRIGHT: (C)2013,JPO&INPIT |
