| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a printed wiring board in which copper ion migration is suppressed and whose insulation reliability between wirings is excellent, and to provide a manufacturing method thereof. <P>SOLUTION: A manufacturing method of a printed wiring board with a surface coated wiring includes a layer formation step of bringing a printed wiring board having a substrate, a copper wiring or a copper alloy wiring disposed on the substrate, and an insulating layer which covers the copper wiring and the copper alloy wiring so that a part of the copper wiring or the copper alloy wiring is exposed into contact with a treatment liquid containing 1,2,3-triazole and/or 1,2,4-triazole and then cleaning the printed wiring board with a solvent to form a copper ion diffusion suppression layer containing the 1,2,3-triazole and/or 1,2,4-triazole on a surface of the exposed copper wiring or copper alloy wiring. <P>COPYRIGHT: (C)2013,JPO&INPIT |
