| 发明名称 |
Cu-Ni-Si-Co BASED COPPER ALLOY FOR ELECTRONIC MATERIAL |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a Cu-Ni-Si-Co based copper alloy in which the spring deflection limit is improved. <P>SOLUTION: The copper alloy copper for an electronic material includes: 1.0-2.5 mass% of Ni; 0.5-2.5 mass% of Co; 0.3-1.2 mass% of Si; and a remainder consisting of Cu and inevitable impurities, wherein the number density of a second phase particle of a grain size of 1-5 nm is 1.0×10<SP POS="POST">12</SP>-1.0×10<SP POS="POST">15</SP>pieces/mm<SP POS="POST">3</SP>. <P>COPYRIGHT: (C)2013,JPO&INPIT |
| 申请公布号 |
JP2012229468(A) |
申请公布日期 |
2012.11.22 |
| 申请号 |
JP20110098348 |
申请日期 |
2011.04.26 |
| 申请人 |
JX NIPPON MINING & METALS CORP |
发明人 |
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| 分类号 |
C22C9/06;C22C9/00;C22C9/01;C22C9/02;C22C9/04;C22C9/05;C22C9/10;C22F1/00;C22F1/08;H01B1/02;H01B5/02 |
主分类号 |
C22C9/06 |
| 代理机构 |
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代理人 |
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| 地址 |
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