发明名称 HIGH BOILING POINT COMPOSITION AND POLYMER LIGHT EMITTING ELEMENT MANUFACTURED USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for forming a thin film using a high boiling point composition with which uniform film thickness can be obtained in film formation. <P>SOLUTION: A composition includes two or more organic compounds having a boiling point of 100&deg;C or above and one or more polymers having light emission properties in a solid state or charge transport properties, and at least one of the organic compounds is an organic compound selected from an aliphatic compound which may have a hetero atom or an alicyclic compound which may have a hetero atom, the aliphatic compound and the alicyclic compound having a boiling point of 200&deg;C or above. In a method for forming a thin film, the thin film is formed from the composition by means of a method selected from the group consisting of: a spin coating method; a casting method; a micro photogravure coating method; a photogravure coating method; a bar coating method; a roll coating method; a wire bar coating method; a dip coating method; a spray coating method; a screen printing method; a flexographic printing method; an offset-printing method; and an ink jet method. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012230904(A) 申请公布日期 2012.11.22
申请号 JP20120142778 申请日期 2012.06.26
申请人 SUMITOMO CHEMICAL CO LTD 发明人 SUZUKI TOMOYUKI;IIMURA KIYOTOSHI
分类号 H05B33/10;C08K5/00;C08L65/00;C09K11/06;H01L51/50 主分类号 H05B33/10
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