发明名称 ANISOTROPIC CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE
摘要 <P>PROBLEM TO BE SOLVED: To provide an anisotropic conductive material which can be rapidly cured and is capable of suppressing corrosion of a metal such as an electrode or conductive particles, and to provide a connection structure using the same. <P>SOLUTION: The anisotropic conductive material according to the present invention contains a curable compound, a cationic initiator, and conductive particles (5). The cationic initiator contains tetrafluoroborate anions. A connection structure (1) according to the present invention comprises a first member (2) to be connected, a second member (4) to be connected, and a connection part (3) electrically connecting the first and second members (2, 4) to be connected. The connection part (3) is formed by curing the anisotropic conductive material. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012230895(A) 申请公布日期 2012.11.22
申请号 JP20120091916 申请日期 2012.04.13
申请人 SEKISUI CHEM CO LTD 发明人 KUBOTA TAKASHI
分类号 H01B1/22;C09J9/02;C09J11/04;C09J11/06;C09J201/00;H01R11/01 主分类号 H01B1/22
代理机构 代理人
主权项
地址