| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for a heating and cooling test, which can uniformly apply a temperature load to connection parts between an electronic component and a circuit board. <P>SOLUTION: A method for a heating and cooling test repeatedly performs a heating step for heating an electronic component 200 which includes a plurality of connecting parts 210 connected to one surface of a circuit board 300 and a cooling step for cooling the electronic component 200. The heating and cooling steps are performed with a soaking material 400 which has higher thermal conductivity than the circuit board 300 arranged on another surface of the circuit board 300. <P>COPYRIGHT: (C)2013,JPO&INPIT |
