| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for mounting electronic components that can use the relatively inexpensive electronic components having a low mounting height, and to provide a heat insulation cover and the electronic components with the heat insulation cover. <P>SOLUTION: The electronic cover having the heat insulation cover mounted therearound to be spaced is disposed on a surface of a substrate. A lead of the electronic components, which is exposed to the outside of the heat insulation cover, is connected to a wiring on the substrate surface. <P>COPYRIGHT: (C)2013,JPO&INPIT |
