发明名称 HEAT SINK
摘要 <P>PROBLEM TO BE SOLVED: To provide an inexpensive heat sink which improves heat radiation performance by pressing a metal plate having excellent heat conductivity without using an aluminum extruded member and facilitating the natural convection, which achieves lightweight and reduces the number of components to simplify the manufacturing processes. <P>SOLUTION: A metal plate having excellent heat conductivity is pressed to be bent so that the vertical cross section forms a C shape to form a body part 10, and multiple vent holes 13 are respectively opened at a top plate 6 and a bottom plate 8 of the body part 10. Further, both sides of the top plate 6, located along the longitudinal direction of the top plate 6, are bent downward to integrally form attachment legs 12 joined to a base plate of an electronic apparatus. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012231043(A) 申请公布日期 2012.11.22
申请号 JP20110099024 申请日期 2011.04.27
申请人 LSI COOLER CO LTD 发明人 ABE NOBUHIRO;YOSHIKAWA RYUICHI
分类号 H05K7/20;H01L23/36 主分类号 H05K7/20
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