发明名称 |
PROTECTION LAYER FOR ADHESIVE MATERIAL AT WAFER EDGE |
摘要 |
This description relates to a semiconductor device including a wafer having a first surface and a second surface opposite to the first surface and a carrier attached to the first surface of the wafer by an adhesive layer, a portion of the adhesive layer adjacent to an edge of the wafer is exposed. The semiconductor device further includes a protection layer to cover the exposed portion of the adhesive layer. The semiconductor device further includes a plurality of dies attached to the second surface and a molding compound encapsulating the plurality of dies.
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申请公布号 |
US2012292783(A1) |
申请公布日期 |
2012.11.22 |
申请号 |
US201213560200 |
申请日期 |
2012.07.27 |
申请人 |
CHIOU WEN-CHIH;WU WENG-JIN;SHUE SHAU-LIN;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
CHIOU WEN-CHIH;WU WENG-JIN;SHUE SHAU-LIN |
分类号 |
H01L23/29 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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