发明名称 TEMPERATURE CALIBRATION DEVICE AND METHOD THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To properly calibrate a temperature of a heat treatment mechanism in a heat treatment apparatus for heat-treating a substrate to a prescribed temperature using the heat treatment mechanism. <P>SOLUTION: A temperature inspection fixture 10 of the temperature calibration device includes: a wafer 70 to be treated which is placed on a heat treatment plate; four temperature measuring resistors 71 which are provided on the wafer 70 to be treated and have resistance values changing according to a temperature change; and eight contact pads 72 which are provided on the wafer 70 to be treated and are electrically connected to the temperature measuring resistors 71 and with which contact pieces are brought into contact when measuring the temperature of the wafer 70 to be treated. The eight contact pads 72 are continuously arranged along a peripheral edge portion of the wafer 70 to be treated. A control section of the temperature calibration device measures the temperature of the wafer 70 to be treated on the basis of the resistance values of the temperature measuring resistors 71 measured via the contact pads 72 and the contact pieces and further adjusts the temperature of the heat treatment plate on the basis of the measured temperature of the wafer 70 to be treated. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012230022(A) 申请公布日期 2012.11.22
申请号 JP20110098990 申请日期 2011.04.27
申请人 TOKYO ELECTRON LTD 发明人 HAYASHI MASAHITO;AZUMA KODAI
分类号 G01K1/14;G01K7/16;G01K7/20;H01L21/66 主分类号 G01K1/14
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