INTEGRATED TRANSLATIONAL LAND-GRID ARRAY SOCKETS AND LOADING MECHANISMS FOR SEMICONDUCTIVE DEVICES
摘要
A land-grid array die package socket is configured for low- or zero insertion-force assembly with a land-grid array die package. For zero insertion-force assembly, a motion plate applies a force on a land-grid array contact that causes a contact tip to move into protective cover while the die package is inserted into the socket. After zero insertion-force assembly, the motion plate applies a force on the land-grid array contact that causes the contact tip to deflect in a positive-Z direction until a useful contact is made at the contact tip with a land-grid array pad.
申请公布号
WO2012108944(A3)
申请公布日期
2012.11.22
申请号
WO2011US67509
申请日期
2011.12.28
申请人
INTEL CORPORATION;AOKI, RUSSELL S.;VALPIANI, ANTHONY P.;DALE, BARRY T.;CHIU, CHIA-PIN
发明人
AOKI, RUSSELL S.;VALPIANI, ANTHONY P.;DALE, BARRY T.;CHIU, CHIA-PIN