| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method capable of collectively curing an ACF and an NCF in manufacturing a connection structure including a wiring board, a first electronic component flip-chip mounted on a surface of the wiring board via the ACF and NCF, and a second electronic component flip-chip mounted on a rear surface of the wiring board. <P>SOLUTION: A manufacturing method of a connection structure includes the steps of: temporarily installing a first electronic component 3 on a surface of a wiring board 1 via a first adhesive film 2; temporarily installing a second electronic component 5 on a rear surface of the wiring board 1 via a second adhesive film 4 having a curing temperature lower than a curing temperature of the first adhesive film 2; placing the wiring board 1 on which the first electronic component 3 and the second electronic component 5 are temporarily installed on a crimp cradle; and collectively mounting the first electronic component 3 on the surface of the wiring board 1 and the second electronic component 5 on the rear surface of the wiring board 1 by heating the first electronic component 3 for the wiring substrate 1 while pressing it from the first electronic component 3 side with a heating and pressurizing tool. <P>COPYRIGHT: (C)2013,JPO&INPIT |
