发明名称 GLASS-BASED SOI STRUCTURE
摘要 <P>PROBLEM TO BE SOLVED: To provide an SOI structure bonded on a support substrate made of oxide glass or oxide glass ceramic. <P>SOLUTION: In a glass-based SOI structure, the oxide glass or oxide glass ceramic is preferably transparent, preferably has a strain point lower than 1,000&deg;C and a specific resistance of 10<SP POS="POST">16</SP>&Omega;-cm or lower at 250&deg;C, and contains positive ions (for example, alkali ions or alkaline-earth ions) movable in the glass or glass ceramic at a high temperature (for example, 300 to 1,000&deg;C) in response to an electric field. Bonding strength between a semiconductor layer 15 and a support substrate 20 is preferably at least 8 J/m<SP POS="POST">2</SP>. The semiconductor layer 15 can have a mixed region where a semiconductor material reacts with oxygen ions generated from the glass or glass ceramic. The support substrate 20 preferably has a depletion region where a concentration of movable positive ions is reduced. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012231161(A) 申请公布日期 2012.11.22
申请号 JP20120148604 申请日期 2012.07.02
申请人 CORNING INC 发明人 JAMES G COUILLARD;JOSEPH F MACH;KISHOR P GADKAREE
分类号 H01L27/12;H01L21/02;H01L21/20;H01L21/30;H01L21/46;H01L21/762 主分类号 H01L27/12
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