发明名称 CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
摘要 A circuit board (10) comprises: a substrate (100) having aperture parts(R10); a plurality of electronic devices (200a, 200b) which are positioned in one of the aperture parts (R10); insulation layers (101, 102) which are positioned upon the substrate (100) and the electronic devices (200a, 200b); and conductive layers (110, 120) which are positioned upon the insulation layers (101, 102). Protrusions (P21, P22) are formed on wall faces of the aperture parts (R10). On at least one site, leading ends of the protrusions (P21, P22) extend between adjacent electronic devices (200a, 200b).
申请公布号 WO2012157426(A1) 申请公布日期 2012.11.22
申请号 WO2012JP61143 申请日期 2012.04.25
申请人 IBIDEN CO., LTD.;MIKADO YUKINOBU;TOMIKAWA MITSUHIRO;TANAKA YUSUKE;FURUTANI TOSHIKI 发明人 MIKADO YUKINOBU;TOMIKAWA MITSUHIRO;TANAKA YUSUKE;FURUTANI TOSHIKI
分类号 H05K3/46 主分类号 H05K3/46
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