发明名称 |
INSULATION FORMULATIONS |
摘要 |
A curable epoxy resin formulation composition useful as insulation for an electrical apparatus including (a) at least one liquid epoxy resin; (b) at least one liquid cyclic anhydride hardener; (c) at least one thermally conducting and electrically insulating filler, wherein the filler includes an epoxy-silane treated filler; and (d) at least one cure catalyst with no amine hydrogens; wherein the epoxy resin formulation composition upon curing provides a cured product with a requisite balance of electrical, mechanical, and thermal properties such as Tg, tensile strength, dielectric strength, and volume resistivity such that the cured product can be used in applications operated at a temperature of greater than or equal to 120 °C. |
申请公布号 |
WO2012158292(A1) |
申请公布日期 |
2012.11.22 |
申请号 |
WO2012US33424 |
申请日期 |
2012.04.13 |
申请人 |
DOW GLOBAL TECHNOLOGIES LLC;ESSEGHIR, MOHAMED;HARRIS, WILLIAM J. |
发明人 |
ESSEGHIR, MOHAMED;HARRIS, WILLIAM J. |
分类号 |
C08G59/42;C08G59/68;C08L63/00;H01B3/40 |
主分类号 |
C08G59/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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