发明名称 SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To equalize power-supply voltages of circuit elements included in a plurality of semiconductor chips which are stacked on one another. <P>SOLUTION: A stacked-type semiconductor device comprises a plurality of semiconductor chips connected to one another via penetrating electrodes. The number of penetrating electrodes included in a path running from a first power-supply terminal to a second power-supply terminal via a circuit element formed in each of the semiconductor chips is equal. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012230961(A) 申请公布日期 2012.11.22
申请号 JP20110097066 申请日期 2011.04.25
申请人 ELPIDA MEMORY INC 发明人
分类号 H01L25/065;H01L25/07;H01L25/18 主分类号 H01L25/065
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