| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an LED light source package mitigating a stress caused by a thermal expansion coefficient difference by mounting a stress mitigation plate which has a thermal expansion coefficient between those of an LED light source module and a metal circuit board, thereby achieving excellent reliability. <P>SOLUTION: In the LED light source package, a stress mitigation plate is mounted between an LED light source module including two or more LED chips connected on a surface of an insulating ceramic substrate and a metal circuit board, the stress mitigation plate comprising a flat aluminum-graphite composite which has a Young's modulus of 70 GPa or less, a thermal expansion coefficient of 5×10<SP POS="POST">-6</SP>-12×10<SP POS="POST">-6</SP>/K at 25-150°C, and a thermal conductivity of 150 W/mK or greater. <P>COPYRIGHT: (C)2013,JPO&INPIT |
