| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a system and method for securing a ball grid array to a printed wiring board. <P>SOLUTION: A ball grid array 200 comprises one or more balls 226 configured to attach to a spring 216 comprising one or more turns. In addition, there is a spacer plate 208, 228 configured to align and separate the springs, a soldering aid 236 configured to align solder on a printed wiring board 230, and the printed wiring board 230 configured with conductive pads 234 to attach to the ball grid array via the springs. <P>COPYRIGHT: (C)2013,JPO&INPIT |
