发明名称 SEMICONDUCTOR DEVICE WITH TEG PAD AND ITS TEG PAD ARRAY METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor device, including a plurality of TEG PADs, such that a probe is not apt to step out of a PAD even when the plurality of TEG PADs are measured simultaneously using a cantilever type probe card, and an array method for TEG PAD such that the probe is not apt to step out of a PAD for the a semiconductor device. <P>SOLUTION: There are provided the semiconductor device which includes the plurality of TEG PADs to be measured by bringing a plurality of probes into contact simultaneously, and is characterized in that the center position of each TEG PAD is arranged within a rectangular area defined as a diagonal between a drop position where a probe is dropped on each TEG PAD and a contact position where the probe finally stops to come into contact; and its TEG PAD array method. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012231054(A) 申请公布日期 2012.11.22
申请号 JP20110099192 申请日期 2011.04.27
申请人 RENESAS ELECTRONICS CORP 发明人 SHINTAKU HIDEOMI
分类号 H01L21/66 主分类号 H01L21/66
代理机构 代理人
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