| 发明名称 |
LIGHT EMITTING DIODE CARRIER |
| 摘要 |
A light emitting diode (LED) carrier assembly includes an LED die mounted on a silicon submount, a middle layer that is thermally conductive and electrically isolating disposed below the silicon submount, and a printed circuit board (PCB) disposed below the middle layer. The middle layer is bonded with the silicon submount and the PCB.
|
| 申请公布号 |
US2012292655(A1) |
申请公布日期 |
2012.11.22 |
| 申请号 |
US201113110642 |
申请日期 |
2011.05.18 |
| 申请人 |
YEH WEI-YU;KO PEI-WEN;SUN CHIH-HSUAN;FU HSUEH-HUNG;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
YEH WEI-YU;KO PEI-WEN;SUN CHIH-HSUAN;FU HSUEH-HUNG |
| 分类号 |
H01L33/62;H01L33/64 |
主分类号 |
H01L33/62 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
