摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus and a method for stably picking up a pick-up target, such as a semiconductor chip, at a high speed. SOLUTION: This pick-up apparatus comprises a thrust-up unit 2 and a pickup unit 3 which face a mount 5 therebetween, on which the pickup targets 4 are arranged. The pickup unit 3 comprises its body 14 reciprocating in the direction of the mount 5 by a driving means 19, and a suction portion 15 provided on the body 14. The thrust-up unit 2 comprises a pressure-detecting means 12, and a thrust-up pin 9 to be subjected to reciprocating motion in the direction of the mount 5 by a driving means 11. The contact pressure between the tip of the thrust-up pin 9 and the pickup target 4 is detected by the pressure-detecting means 12. COPYRIGHT: (C)2009,JPO&INPIT |