| 摘要 |
PURPOSE: A wafer processing apparatus is provided to minimize the generation of errors in the wafer processing process by improving the reliability of adhesion for absorbing a cover of a FOUP(Front Opening Unified Pod). CONSTITUTION: A supporting plate(110) is combined with an object(200). A stage(120) is combined with the front side of the supporting plate. The stage comprises a plurality supporting pins(121) for supporting a FOUP(Front Opening Unified Pod)(51), a sensor(123), and a clamper(125). A door(130) is detachably combined with a cover(51) of the FOUP. An absorption member(140) transfers elevating movement of the door to the cover.
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