Systems for circuit board heat transfer and method of assembling same

摘要

A heat removal system (250) for a circuit board assembly is provided. The system includes a printed circuit board (PCB) (106), at least one thermal via (222) extending through the PCB, and a thermal interface material (TIM) (122) coupled to the at least one thermal via such that heat is removed from the PCB through the at least one thermal via and the TIM.