| 摘要 |
PURPOSE: A semiconductor device, a manufacturing method thereof, and a semiconductor module using the same are provided to improve generality of a semiconductor module by corresponding an array shape of a protrusion electrode to an existing wiring pattern. CONSTITUTION: A wiring board(2) has a first side(2a) including a first wiring layer(3) and a second side(2b) including a second wiring layer(4). A semiconductor chip(6) is mounted on the first side of the wiring board. A connection member electrically connects the first wiring layer with an electrode pad. A first protrusion electrode(10) is electrically connected with the first wiring layer. A second protrusion electrode(11) is electrically connected with the second wiring layer. |
