| 摘要 |
PURPOSE: A method for dividing an optical device wafer is provided to improve productivity by dividing an optical device wafer into a light device chip using a reformed layer as a division start point. CONSTITUTION: An optical light device wafer(11) is formed by laminating an epitaxial layer(15) on a sapphire substrate(13). The optical light device has a surface(11a) and a rear side(11b). A reflective film(21) is formed on a rear side of the optical device wafer. The reflective film includes a metal layer or a DBR(Distributed Bragg Reflector). A plurality of optical devices(19) is formed on a division line which is formed as a lattice type. |
