| 摘要 |
PURPOSE: A bonding device of a panel for an electronic component is provided to consecutively perform a main bonding work by a bonding module and a deaeration work by an autoclave. CONSTITUTION: A plurality of jigs(3) are radially installed on an upper portion of an upper turntable(1). A plurality of bonding modules(4) are radially installed on an upper portion of a lower turntable(2). A first vacuum chamber member is installed on the outside of an opening/closing member of a panel bonding tool. An autoclave is installed in a portion adjacent to the bonding modules. |
