发明名称 METHOD OF MAKING HEAT-DISSIPATING PANEL, HEAT-DISSIPATING PANEL MADE USING SAID METHOD, PANEL-FORMED STRUCTURE AND HEAT-DISSIPATING SYSTEM
摘要 FIELD: physics. ^ SUBSTANCE: method of making a heat-dissipating panel 100, having a configuration wherein an electroconductive thin layer 120 is provided on at least one surface of a transparent sheet 110 and the electroconductive thin layer 120 releases heat when electric energy is transmitted to it, for example, for windows. The method involves fixing a metal strip 132 on the electroconductive thin layer 120 formed on the sheet 110 along each of the opposite sides of the sheet 110; depositing an electroconductive paste 134 on top of each metal strip 132 in order to coat said metal strip; bringing into contact the heat-dissipating part 220 of the heating device 200 on edges which form two sides of the sheet 110, where the metal strip 132 is fixed, in a state in which temperature of the heat-dissipating part 220 is higher than the given temperature; the heat-dissipating part 220 is longer than at least the full length of the metal strip 132; and hardening the electroconductive paste 134 to form electrodes having a metal strip and electroconductive paste 134; and electrically connecting the wire lead 140 with each of the electrodes 130. ^ EFFECT: invention enables to make a heat-dissipating panel with low current consumption and fewer connected wires. ^ 9 cl, 12 dwg
申请公布号 RU2467519(C2) 申请公布日期 2012.11.20
申请号 RU20110104226 申请日期 2008.07.08
申请人 FIGLA , KO., LTD. 发明人 DAMMURA JOSIKAZU;ITO TOSIAKI;SAVADA TAKAKAZU;KHINO EHTSUO;KHONDA JASUTOSI;OKUNO GAKU;JAMANAKA KATSUNOBU;TANAKA MUNEJUKI
分类号 H05B3/86 主分类号 H05B3/86
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