发明名称 Semiconductor device and manufacturing method thereof
摘要 First semiconductor layers are in source/drain regions on the semiconductor substrate. A second semiconductor layer comprises first portions on the first semiconductor layers and a second portion in a linear form in a channel region between the source/drain regions. A gate electrode is around the second portion of the second semiconductor layer via an insulating film. A film thickness of the second portion of the second semiconductor layer is smaller than a film thickness of the first portion of the second semiconductor layer.
申请公布号 US8314464(B2) 申请公布日期 2012.11.20
申请号 US20100700502 申请日期 2010.02.04
申请人 IWAYAMA MASAYOSHI;ASAO YOSHIAKI;KAJIYAMA TAKESHI;KABUSHIKI KAISHA TOSHIBA 发明人 IWAYAMA MASAYOSHI;ASAO YOSHIAKI;KAJIYAMA TAKESHI
分类号 H01L29/78 主分类号 H01L29/78
代理机构 代理人
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