| 摘要 |
PURPOSE: A photosensitive resin composition, a photosensitive element, a forming method of resist patterns, and a manufacturing method of a printed wiring board are provided to improve the plating resistance characteristic of the composition. CONSTITUTION: A photosensitive resin composition includes a binder polymer, a photopolymerizable compound with an ethylenically unsaturated bond, a photopolymerization initiator. The binder polymer includes 50-80 weight% of a structural unit derived from benzyl(meth)acrylate, 5-40 weight% of a structural unit derived from styrene, 1-20 weight% of a structural unit derived from (meth)acrylic acid alkyl ester, and 5-30 weight% of a structural unit derived from (meth)acrylate. A photosensitive element includes a supporting film(10) and a photosensitive resin composition layer(20) made of the composition.
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