Epoxy resin composition, an adhesive film and a multi-layered printed circuit board prepared by using the same,申请号KR20090110904-传众专利搜索

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发明名称	Epoxy resin composition, an adhesive film and a multi-layered printed circuit board prepared by using the same
摘要
申请公布号	KR101203156(B1)	申请公布日期	2012.11.20
申请号	KR20090110904	申请日期	2009.11.17
申请人		发明人
分类号	C08L63/02;C08K5/1539;C08L9/00;H05K3/46	主分类号	C08L63/02
代理机构		代理人
主权项
地址

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