发明名称 |
Method for manufacturing semiconductor device |
摘要 |
An object is to provide a semiconductor device with excellent reproducibility which is manufactured at low cost. A manufacturing method of a semiconductor device includes steps of forming a first electrode over a substrate; forming an insulating layer over the substrate and the first electrode; pressing a mold against the insulating layer to form an opening in the insulating layer; separating the mold from the insulating layer in which the opening is formed; hardening the insulating layer in which the opening is formed to form a partition wall; forming a light-emitting layer over the first electrode and the partition wall; and forming a second electrode over the light-emitting layer. The insulating layer contains a thermosetting resin material or a light curable resin material. The partition wall has a cross-sectional taper angle of 20 to 50°, and edges of a top and bottom thereof are rounded. |
申请公布号 |
US8313355(B2) |
申请公布日期 |
2012.11.20 |
申请号 |
US20070806870 |
申请日期 |
2007.06.05 |
申请人 |
FUJII TERUYUKI;SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
发明人 |
FUJII TERUYUKI |
分类号 |
H01L27/32;H01L27/28 |
主分类号 |
H01L27/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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