| 摘要 |
FIELD: physics. ^ SUBSTANCE: invention relates to an electronic board which is meant, for example, for integration into on-board equipment of an aircraft. Offsetting insulating areas of one layer relative the other enables to bring the working conducting area of one of the two layers "closer" to the peripheral area of the other layer. Insulating areas, which are bad heat conductors, are no longer stacked on one another, thus the heat barrier effect associated with layering in the same zone of these insulating areas is significantly reduced. This is achieved due to that the electronic board has at least two conducting layers (2') stacked on each other with an insulating layer (3') between two conducting layers (2'), wherein each of the two conducting layers (2') has a working conducting layer (7'); an insulating area (8') lies between conducting areas (6', 7'), wherein the insulating area (8') of the first of the two layers (2') is offset from the insulating area (8') of the second of the layers (2'). The aircraft has a chassis (10') on which at least one electronic board is mounted. ^ EFFECT: design of an electronic board which is reliable and has improved characteristics in terms of heat dissipation. ^ 18 cl, 2 dwg |
