发明名称 Method for fabricating semiconductor device with buried gates
摘要 A method for fabricating a semiconductor device includes: forming a thin film over trenches by using a first source gas and a first reaction gas; performing a first post-treatment on the thin film by using a second reaction gas; and performing a second post-treatment on the thin film by using a second source gas.
申请公布号 US8314021(B2) 申请公布日期 2012.11.20
申请号 US20100938806 申请日期 2010.11.03
申请人 CHO JIK-HO;YEOM SEUNG-JIN;HONG SEUNG-HEE;LEE NAM-YEAL;HYNIX SEMICONDUCTOR INC. 发明人 CHO JIK-HO;YEOM SEUNG-JIN;HONG SEUNG-HEE;LEE NAM-YEAL
分类号 H01L21/3205;H01L21/4763 主分类号 H01L21/3205
代理机构 代理人
主权项
地址