发明名称 |
Probe card, semiconductor inspecting apparatus, and manufacturing method of semiconductor device |
摘要 |
A frame bonded and fixed to a back face of a probe sheet so as to surround a group of pyramid-shaped or truncated pyramid-shaped contact terminals collectively formed at a central region portion of the probe sheet on a probing side thereof is protruded from a multi-layered wiring board, and pressing force is imparted to the frame and a pressing piece at a central portion by a plurality of guide pins having spring property so as to tilt finely. |
申请公布号 |
US8314624(B2) |
申请公布日期 |
2012.11.20 |
申请号 |
US201113072235 |
申请日期 |
2011.03.25 |
申请人 |
KASUKABE SUSUMU;OKAMOTO NAOKI;RENESAS ELECTRONICS CORPORATION |
发明人 |
KASUKABE SUSUMU;OKAMOTO NAOKI |
分类号 |
G01R31/00 |
主分类号 |
G01R31/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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