| 摘要 |
A composition for forming a low dielectric thin film, which includes a silane polymer, porous nanoparticles and an organic solvent, and a method of preparing a low dielectric thin film using the same. The low dielectric thin film prepared using the composition of the current invention may exhibit a low dielectric constant and excellent mechanical strength, and thus may be applied to conductive materials, display materials, chemical sensors, biocatalysts, insulators, packaging materials, etc. |
