发明名称 |
METHODS AND APPARATUS FOR APPLYING AN ADHESIVE TO A CIRCUIT BOARD |
摘要 |
Methods and apparatus for curing an adhesive on a circuit board are disclosed. In one aspect, a method of manufacturing is provided that includes isolating a first portion of a surface of a circuit board from a second portion of the surface with a flexible gasket. An adhesive is applied to the first portion of the surface. The adhesive is thermally cured. The flexible gasket prevents constituents outgassed from the adhesive from contaminating the second portion of the surface.
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申请公布号 |
US2012288996(A1) |
申请公布日期 |
2012.11.15 |
申请号 |
US201113106231 |
申请日期 |
2011.05.12 |
申请人 |
TOO SEAH S.;TEE KIAT HENG |
发明人 |
TOO SEAH S.;TEE KIAT HENG |
分类号 |
H01L21/50;H01L21/58 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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