| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multilayer substrate circuit that allows ensuring high isolation even if the distance between communication channels is shortened by downsizing and integrating the circuit and allows suppressing the manufacturing cost. <P>SOLUTION: A multilayer substrate circuit comprises: a communication channel layer in which a plurality of communication channels are provided; and a ground layer that is located under the communication channel layer and is grounded. The multilayer substrate circuit is further provided with a first line conductor and a second line conductor. The first line conductor is provided between the adjacent communication channels in the communication channel layer, and both ends are grounded to the ground layer through a via penetrating through each of the layers. The second line conductor is provided in a layer between the communication channel layer and the ground layer in parallel with the first line conductor, and both ends are grounded to the ground layer through the via. <P>COPYRIGHT: (C)2013,JPO&INPIT |
