| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor wafer cover that can prevent accumulation of materials on a second surface of a semiconductor wafer without scratching the semiconductor wafer. <P>SOLUTION: A semiconductor wafer cover comprises a first cover and a second cover. The first cover houses a semiconductor wafer so as to cover at least an outer edge portion of a second surface of the semiconductor wafer while exposing a first surface of the semiconductor wafer and has a first opening in its center portion. The second cover engages with the first opening and covers the center portion of the second surface of the semiconductor wafer. The inner side surface of the first opening has a taper shape so that the diameter of the first opening becomes smaller toward a non-mounting surface of the semiconductor wafer from a mounting surface of the semiconductor wafer. <P>COPYRIGHT: (C)2013,JPO&INPIT |
