| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a substrate processing apparatus which reduces a burden for introducing new equipment to an existing substrate processing apparatus and removes a thick deposition film adhered to an inner wall of the substrate processing apparatus. <P>SOLUTION: A substrate processing apparatus 1 includes: a chamber 11; a stage 12 holding a substrate in the chamber 11; a cleaning gas supply system 60 supplying a cleaning gas, removing a deposit adhered to the interior of the chamber 11 through a process performed to the substrate, to the chamber 11; and an exhaust system 30 exhausting the gas in the chamber 11 from a gas exhaust port 15 provided at a bottom wall of the chamber 11. In the substrate processing apparatus 1, a groove 16 is provided around the gas exhaust port 15 in the chamber 11. <P>COPYRIGHT: (C)2013,JPO&INPIT |
